Redmi, which develops successful phones under the roof of Xiaomi, one of the biggest smartphone manufacturers in the world, is preparing to come up with an ambitious model. Called the Redmi K30 Pro, the phone has been the subject of many leaks before. Days before the launch of the device of the Chinese brand, the K30 Pro has been dismantled. Redmi K30 Pro is shattered:
In the video that Redmi K30 Pro was released by Redmi Product Director Wang Teng Thomas, we see the structure of a very well integrated “sandwich” motherboard. The K30 Pro uses a pop-up fullscreen and camera-centric design. The space the internal motherboard organizes components is largely compressed, and only 66% of the motherboard area can adjust components. The large number of components of a 5G mobile phone correspond to about 2.7 times that of a 4G mobile phone, which brings a second challenge to space layout. To solve this problem, the K30 Pro uses an ultra-high integration design, arranged with about 61 components per 1 cm square area. Redi K30 Pro features: The device will come with a 64MP Sony IMX686 sensor. The phone, which can record videos in 8K (7680 x 4320) resolution, also hosts dual OIS features. This means that the device can offer stable shooting in almost any condition. The rear camera setup also includes a telephoto sensor capable of 3x optical zoom and 30x digital zoom. The Redmi K30 Pro, which will come with the Qualcomm Snapdragon 865 chipset, AMOLED display that supports 60Hz refresh rate, and more, will be unveiled at an online event in China on March 24.
title: “Redmi K30 Pro To Be Launched On 24 March” ShowToc: true date: “2023-03-07” author: “Jessica Hunt”
Redmi, which develops successful phones under the roof of Xiaomi, one of the biggest smartphone manufacturers in the world, is preparing to come up with an ambitious model. Called the Redmi K30 Pro, the phone has been the subject of many leaks before. Days before the launch of the device of the Chinese brand, the K30 Pro has been dismantled. Redmi K30 Pro is shattered:
In the video that Redmi K30 Pro was released by Redmi Product Director Wang Teng Thomas, we see the structure of a very well integrated “sandwich” motherboard. The K30 Pro uses a pop-up fullscreen and camera-centric design. The space the internal motherboard organizes components is largely compressed, and only 66% of the motherboard area can adjust components. The large number of components of a 5G mobile phone correspond to about 2.7 times that of a 4G mobile phone, which brings a second challenge to space layout. To solve this problem, the K30 Pro uses an ultra-high integration design, arranged with about 61 components per 1 cm square area. Redi K30 Pro features: The device will come with a 64MP Sony IMX686 sensor. The phone, which can record videos in 8K (7680 x 4320) resolution, also hosts dual OIS features. This means that the device can offer stable shooting in almost any condition. The rear camera setup also includes a telephoto sensor capable of 3x optical zoom and 30x digital zoom. The Redmi K30 Pro, which will come with the Qualcomm Snapdragon 865 chipset, AMOLED display that supports 60Hz refresh rate, and more, will be unveiled at an online event in China on March 24.
